The PH150080309 piezoelectric ring stack consists of multiple chips that are bonded via epoxy and glass beads. The stack offers a maximum displacement of 9.0 μm ± 15%. A red wire is attached to the electrode that should receive positive bias, and a bl
ack wire is attached to the electrode that should be grounded.
![](https://chinaultrasound.com/wp-content/uploads/2020/01/PH150080309-SpecSheet.jpg)
![](https://chinaultrasound.com/wp-content/uploads/2020/01/ring-stacks-1.jpg)
![](https://chinaultrasound.com/wp-content/uploads/2020/01/ring-stacks-2-1024x457.jpg)
![](https://chinaultrasound.com/wp-content/uploads/2020/01/ring-stacks.jpg)